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Thermal Conductive Gel

Thermal conductive gel is a thermal interface material with single component. The material has some stress-strain value superior than the ultra-soft silicone sheet. It can be automatedly dispensed and coated. It is the best heat dissipation solution when multiple chips share a radiator and structures.


High thermal conductivity,low thermal resistance

Small young modulus

Excellent machinbility


  PROPERTIES
ItemsParameterUnitTest Method
HTG-300HTG-500
AppearancePink pasty substanceDark grey pasty substance---Visual
Density3.2(±0.5)3.1(±0.5)g/cm3ASTM D 792
Volatilize Point(200℃,24h)≤200≤200ppmGB269-85
50% Instantaneous compressive stress<10<10psiGB/T 7757-2009
50% Static compressive stress<1<1psiGB/T 7757-2009
Adhesive force<15<15psi-
Operating Temp-50~150-50~150-
  THERMAL CHARACTERISTIC
Thermal Conductivity3.2(±0.25)5.0(±0.5)W/m · KASTM D 5470
Thermal Resistance≤0.08(@20Psi)≤0.04(@20Psi)℃in2/WASTM D 5470
  ELECTRICAL PROPERTIES
Breakdown Voltage≥8(@1mm)≥2.5(@1mm)KV/mmASTM D 149
Volume Resistivity≥1012≥1010Ω · cmASTM D 257



COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
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Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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