Thermal conductive gel is a thermal interface material with single component. The material has some stress-strain value superior than the ultra-soft silicone sheet. It can be automatedly dispensed and coated. It is the best heat dissipation solution when multiple chips share a radiator and structures.
High thermal conductivity,low thermal resistance
Small young modulus
Excellent machinbility
| PROPERTIES | ||||
| Items | Parameter | Unit | Test Method | |
| HTG-300 | HTG-500 | |||
| Appearance | Pink pasty substance | Dark grey pasty substance | --- | Visual |
| Density | 3.2(±0.5) | 3.1(±0.5) | g/cm3 | ASTM D 792 |
| Volatilize Point(200℃，24h) | ≤200 | ≤200 | ppm | GB269-85 |
| 50% Instantaneous compressive stress | ＜10 | ＜10 | psi | GB/T 7757-2009 |
| 50% Static compressive stress | ＜1 | ＜1 | psi | GB/T 7757-2009 |
| Adhesive force | ＜15 | ＜15 | psi | - |
| Operating Temp | -50~150 | -50~150 | ℃ | - |
| THERMAL CHARACTERISTIC | ||||
| Thermal Conductivity | 3.2(±0.25) | 5.0(±0.5) | W/m · K | ASTM D 5470 |
| Thermal Resistance | ≤0.08（@20Psi） | ≤0.04（@20Psi） | ℃in2/W | ASTM D 5470 |
| ELECTRICAL PROPERTIES | ||||
| Breakdown Voltage | ≥8(@1mm) | ≥2.5(@1mm) | KV/mm | ASTM D 149 |
| Volume Resistivity | ≥1012 | ≥1010 | Ω · cm | ASTM D 257 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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