3C is an abbreviation for three types of electronic products: computer, communication, and consumer electronics. Now many IT industries are marching into the 3C field. Taking 3C fusion technology products as a breakthrough for development has become a new bright spot in the IT industry. Rich 3C electronic products play a variety of roles in people's daily lives, providing information, giving convenience, and even inspiring everyone's creativity. In product development, designers are pursuing lighter, thinner and more portable products. Therefore, the product will inevitably encounter more and more EMI and heat dissipation problems during the entire design process. As a domestic strength influencer in these two aspects, Hongfucheng is based on more than a decade of exploration and innovation in the 3C industry Dedication to provide customers with solutions.
The advantages and characteristics of notebook computers compared to traditional desktop computers are thin and light. Due to the narrow internal space of the notebook body and the high concentration of high-heat components, it brings great pressure on its heat dissipation. Generally, designers will use a combination of heat pipes and cooling air ducts. It achieves heat dissipation, but how to transfer the heat generated by the components to the heat pipe is very critical. HFC provides a solution that combines thermally conductive silicone gaskets and phase changes to change the components that generate large amounts of heat, such as the main chip and GPU. The material is used as the interface material, and other components with small heat generation use thermal pads as the thermal interface material to well solve the heat transfer from the heating components to the heat pipe, so that the heat can be evenly and quickly passed through the air duct and air convection to achieve The purpose of heat dissipation.
Recommended product solution: Thermally conductive silicone gasket H300 series H400 series
Due to the increasing integration of components, heating components of different heights are usually on the same motherboard. If a whole piece of gasket is used, the pressure on each component is different, which will cause some components during assembly Or the case is damaged, so to achieve good heat conduction in a complex thermal environment, only a thermal pad can be attached to each electronic component, which has a great impact on efficiency and error rate. According to the special characteristics of such devices, HFC To develop a low-stress-strain, thermally conductive interface material suitable for dispensing operations. This material can be used for dispensing operations to improve operability. At the same time, the low stress-strain performance is suitable for the thermal conductivity requirements of components at different heights on the same interface. Good fluidity, good compatibility with the interface, and extremely low thermal resistance, which solves the heat conduction problem of such devices.
Recommended product solution: Thermal grease HTG100
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