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2003

Shenzhen HFC Shiedling Products Co., Ltd. was established. R&D and production of EMI/EMC materials.

2005

The branch office of sales was established in Japan. Conductive Gasket die- cut technology by automatic machine.

2007

R&D and production of Absorber materials

2009

The branch office of sales was established in USA and in HK. R&D and production TIM materials

2010

SuZhou HFC-sub was established. HFC has established the first intelligent production line in China.

2011

Chongqing HFC-sub was established.

2012

6 laboratories were established including in MianYang, Zhongshan, Panyu etc. HFC has established the first automatic production line for I/O Gasket in China.

2013

R&D and production of Ferrite sheet materials R&D and Production thermal pad of 6W/m.k

2014

The branch office of sales was established in Taiwan. R&D and production Thermal Grease, Conductivity Thermal Pad, Non-silicon Thermal Pads

2015

R&D and Production of Thermal Gel. 1~5W/m.k Non-silicon thermal gel be easy to peeling off.

2016

R&D and production of 3W/m.k Phase-change material Thermal pad is used for Automotive industry.

2017

1. High performance of thermal pad 10-20W/m.k.
2. Anti-RF thermal pad 1-3W/m.k
3. Soft Thermal pad of 7W/m.k
4. TIM of Low temperature metal materials

2018

Surface anisotrope de controle thermique pour systeme 5G Won the Gold Award of the 46th Geneva International Invention Exhibition
America R&D 100 Honorary Unit.

2019

Anisotropic Thermal Gap Filler (20~50W/m.k)

Vltra-thin Vapor Chamber

Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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