The dispensable thermal gel cures to a flexible rubber elastomer and suit for the protection of electrical/electronic applications where heat dissipation is very importand. It is suitable when the different components share a radiator. It can be automatedly dispensed and realize automatic production. The dispensable thermal gel will not pollute the component because it is easy to peel after curing and rework.
High thermal conductivity,low thermal resistance
Use dispensable pad to replace traditional fabricated pad
Being capable of printed through a variety of manual or automated process
Can be dispensed or printed through a variety of manual or automated process
Can be dispensed or coated into a variety of thickness and shapes
Soft,relieving stress and shock mitigation
Desired thickness is maintained after curing
PROPERTIES | |||
Items | Parameter | Unit | Test Method |
HTDG-250 | |||
Appearance | White pasty substance | --- | Visual |
Density | 2.6(±0.5) | g/cm3 | ASTM D 792 |
Hardness | 30(±5) | Shore C | ASTM D 2240 |
Tensile Strength | ≥0.4 | Mpa | ASTM D 412 |
Elongation | ≥200 | % | ASTM D 412 |
Curing Time | 120(50℃),55(70℃),25(120℃) | min | - |
50% Instantaneous compressive stress | <10 | psi | GB/T 7757-2009 |
50% Static compressive stress | <1 | psi | GB/T 7757-2009 |
Adhesive force | <15 | psi | - |
Operating Temp | -50~150 | ℃ | - |
THERMAL CHARACTERISTIC | |||
Thermal Conductivity | 2.5(±0.2) | W/m · K | ASTM D 5470 |
ELECTRICAL PROPERTIES | |||
Breakdown Voltage | ≥8(@1.5mm) | KV/mm | ASTM D 149 |
Volume Resistivity | ≥1013 | Ω · cm | ASTM D 257 |
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