Silicone free thermal gel is a thermal interface material without a low molecular siloxane. Silicone oil volatilization and pollution of components. It is especially suitable for places sensitive to silicone oil. Because its thickness is not sensitive and it has good adaptability in the equipment assembly-process,so that it is compatible with tolerance of the relevant devices or structures brought by different sizes.
High thermal conductivity,low thermal resistance
Working under low pressure
No silicone oil volatilization,no pollution
Excellent electrical insulation performance and heat resistance
| PROPERTIES | ||||
| Items | Parameter | Unit | Test Method | |
| HTG-300SF | HTG-500SF | |||
| Appearance | White pasty substance | Grey pasty substance | --- | Visual |
| Density | 3.11(±0.5) | 3.05(±0.5) | g/cm3 | ASTM D 792 |
| Volatilize Point(200℃，24h) | 0 | 0 | ppm | GB269-85 |
| Extrusion rate | 10±3（@0.6Mpa） | 5±2（@0.6Mpa） | g/min | - |
| Needle penetration | 24±3 | 16±3 | mm | GB/T 4985-2010 |
| 50% Instantaneous compressive stress | ＜40 | ＜20 | psi | GB/T 7757-2009 |
| 50% Static compressive stress | ＜1 | ＜1 | psi | GB/T 7757-2009 |
| Adhesive force | ＜15 | ＜15 | psi | - |
| Operating Temp | -50~150 | -50~150 | ℃ | - |
| THERMAL CHARACTERISTIC | ||||
| Thermal Conductivity | 3.0(±0.25) | 5.0(±0.5) | W/m · K | ASTM D 5470 |
| Thermal Resistance | ≤0.07（@20Psi） | ≤0.06（@20Psi） | ℃in2/W | ASTM D 5470 |
| ELECTRICAL PROPERTIES | ||||
| Breakdown Voltage | ≥8(@1mm) | ≥8(@1mm) | KV/mm | ASTM D 149 |
| Volume Resistivity | ≥108 | ≥108 | Ω · cm | ASTM D 257 |
Production equipment and testing equipment to ensure high quality.
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