Home >> Application

Netcom Industry

Pulished on Jan. 21, 2020

With the intelligent processing of electrical appliances and electronic products, many electronic devices need to be operated and controlled through the network. Therefore, the working frequency and intensity of Netcom products have also increased. The faster network speed has also increased the power of Netcom products. Other issues still bring higher demand for heat dissipation.

Application of thermal silica gel

Computer motherboard--thermal silica

Computer motherboard--thermal silica

Computer motherboard--thermal silica

Computer motherboard--thermal silica

Shielding material application

There is a large gap at each interface of a host of a certain brand. During operation, it will be subject to relatively strong electromagnetic interference from the outside world, which will affect the stability of the host. Use conductive foam pads to connect the interfaces to the chassis. Improved its overall shielding effectiveness.

iMac--Conductive Filament

iMac--Conductive Filament

TV motherboard-SMT foam

TV motherboard-SMT foam

Computer motherboard--SMT foam

Computer motherboard--SMT foam

Hfc Solutions
Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

Copyright © Shenzhen HFC Shielding Products Co., Ltd. All Rights Reserved | Sitemap | Technical Support  

oversea@szemi.cn