Solve the heat dissipation problems caused by warping of high power/large area chips.
Using directional arrangement technology to provide a continuous thermal conduction path.
The thermal conductivity is more than ten times that of conventional thermal interface materials.
It has the innovative advantages of high reliability, low density, high resilience, and zero spillage.
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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