Tags: Thermal Gap Filler , RF Absorber Material , EMI/EMC Shielding Material
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  • Thermal Pad

Thermal Pad

Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances. It used to fill the gap and realize the heat transfer between the heating parts and cooling parts.It also has insulation and shock mitigation effects Meanwhile, it can satisfy the design requirements for minitype and ultra-thin equipments with excellent manufacturability and practicability. With wide range of thickness, it is widely used in electronic.

● Soft, excellent compression performance

● Low thermal resistance

● Being recognized as UL94 V-0

● Viscous surface

● Being able to work under low pressure

● Excellent insulation performance and thermal resistance

COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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