Thermal gap filler has excellent flexibility insulation,compressibility and natural surface viscosity performances. It used to fill the gap and realize the heat transfer between the heating parts and cooling parts. It also has insulation and shock mitigation effects meanwhile,it can satisfy the design requirements for minitype and ultra-thin equipment with excellent manufacturability and practicability. With wide range of thickness, it is widely used in electronic products.
Low thermal resistance
Being recognized as UL94V0
Being able to work under low pressure
Excellent insulation performance and thermal resistance
|Thickness||1~3||mm||ASTM D 374|
|Hardness||50(±5)||Shore C||ASTM D 2240|
|Density||3.6±0.5||g/cc||ASTM D 792|
|Compression Ratio||≥35（@50psi）||%||ASTM D 695|
|Tear strength||≤1||N/mm||ASTM D 624|
|Operating Temperature||-50~120||℃||IEC 60068-2-14|
|Thermal Conductivity||10±0.5||W/m · K||ASTM D 5470|
|Thermal Resistance||≤0.35（@10Psi/2mm）||℃in2/W||ASTM D 5470|
|Breakdown Voltage||≥8||KV/mm||ASTM D 149|
|Volume Resistivity||≥1012||Ω · cm||ASTM D 257|
|Dielectric Constant||≥2||@1MHz||ASTM D 150|
|Dielectric Loss||≤0.1||@1MHz||ASTM D 150|
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3C is an abbreviation for three types of electronic products: computer, communication, and consumer electronics.
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