Thermal gap filler has excellent flexibility insulation, compressibility and natural surface viscosity performances.it used to fill the gap and realize the heat transfer between the heating parts and cooling parts.It also has insulation and shock mitigation effects meanwhile, it can satisfy the design requirements for mini type and ultra-thin equipment with excellent manufacturability and practicability . with wide range of thickness ,it is widely used in electronic products.
Soft,excellent compression performance
Low thermal resistance
Being recognized as UL94V0
Being able to work under low pressure
Excellent insulation performance and thermal resistance
|Thickness||0.2~18||mm||ASTM D 374|
|Hardness||8~60(±5)||Shore C||ASTM D 2240|
|Density||2.35±0.5||g/cc||ASTM D 792|
|Tensile strength||≥0.3||Mpa||ASTM D 412|
|Elongation||≥80||%||ASTM D 412|
|Compression Ratio||≥25（@50psi）||%||ASTM D 695|
|Operating Temperature||-50~180||℃||IEC 60068-2-14|
|Thermal Conductivity||1.0±0.2||W/m · K||ASTM D 5470|
|Thermal Resistance||≤2.0（@20Psi/1mm）||℃in2/W||ASTM D 5470|
|Breakdown Voltage||≥8||KV/mm||ASTM D 149|
|Volume Resistivity||≥1010||Ω · cm||ASTM D 257|
|Dielectric Constant||≥2||@1MHz||ASTM D 150|
|Dielectric Loss||≤0.1||@1MHz||ASTM D 150|
All above data are copyrighted and elaborated by HFC.
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
+86 755 2370 6023
+86 755 2730 6260
3C is an abbreviation for three types of electronic products: computer, communication, and consumer electronics.
Copyright © Shenzhen HFC Co., Ltd. All Rights Reserved | Sitemap | Technical Support