HFC H1000-soft thermal conductive silicone pad is a kind of thermal interface material with high thermal conductivity, low thermal resistance and single surface. The product has good stress response and ultra-low installation stress, which can avoid the damage of installation stress to parts such as chip, PCB and so on. The product has natural viscosity and high compressibility, which can gill the gap well and realize heat transfer between heating parts and cooling parts. It is an excellent heat conducting filler and is widely used in electronic products.
Being able to work under low pressure
Excellent insulation performance and thermal resistance
No rebound stress or low rebound stress
Low thermal resistance
Good interface contact
Excellent insulation performance and high breakdown voltage
Single adhesive
PROPERTIES | |||
Items | Parameter | Unit | Test Method |
Color | Gray White | --- | Visual |
Thickness | 1~3 | mm | ASTM D 374 |
Hardness | 30(±5) | Shore C | ASTM D 2240 |
Density | 3.6±0.5 | g/cc | ASTM D 792 |
Compression Ratio | ≥50(@50psi) | % | ASTM D 695 |
Tear strength | ≤1 | N/mm | ASTM D 624 |
UL Certificaton | V-0,5V | --- | UL-94 |
Operating Temperature | -50~120 | ℃ | IEC 60068-2-14 |
THERMAL CHARACTERISTIC | |||
Thermal Conductivity | 10±0.5 | W/m · K | ASTM D 5470 |
Thermal Resistance | ≤0.35(@10Psi/2mm) | ℃in2/W | ASTM D 5470 |
ELECTRICAL PROPERTIES | |||
Breakdown Voltage | ≥8 | KV/mm | ASTM D 149 |
Volume Resistivity | ≥1012 | Ω · cm | ASTM D 257 |
Dielectric Constant | ≥2 | @1MHz | ASTM D 150 |
Dielectric Loss | ≤0.1 | @1MHz | ASTM D 150 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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