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H1000-Soft Thermal Gap Giller

HFC H1000-soft thermal conductive silicone pad is a kind of thermal interface material with high thermal conductivity, low thermal resistance and single surface. The product has good stress response and ultra-low installation stress, which can avoid the damage of installation stress to parts such as chip, PCB and so on. The product has natural viscosity and high compressibility, which can gill the gap well and realize heat transfer between heating parts and cooling parts. It is an excellent heat conducting filler and is widely used in electronic products.


Being able to work under low pressure

Excellent insulation performance and thermal resistance

No rebound stress or low rebound stress

Low thermal resistance

Good interface contact

Excellent insulation performance and high breakdown voltage

Single adhesive


  PROPERTIES
ItemsParameterUnitTest Method
ColorGray White---Visual
Thickness1~3mmASTM D 374
Hardness30(±5)Shore CASTM D 2240
Density3.6±0.5g/ccASTM D 792
Compression Ratio≥50(@50psi)%ASTM D 695
Tear strength≤1N/mmASTM D 624
UL CertificatonV-0,5V---UL-94
Operating Temperature-50~120IEC 60068-2-14
  THERMAL CHARACTERISTIC
Thermal Conductivity10±0.5W/m · KASTM D 5470
Thermal Resistance≤0.35(@10Psi/2mm)℃in2/WASTM D 5470
  ELECTRICAL PROPERTIES
Breakdown Voltage≥8KV/mmASTM D 149
Volume Resistivity≥1012Ω · cmASTM D 257
Dielectric Constant≥2@1MHzASTM D 150
Dielectric Loss≤0.1@1MHzASTM D 150



COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

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Shenzhen, China 

 
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Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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