HFC HTG-1200 Thermally conductive gel is a thermal interface material with single-component. The material has some stress-strain value superior than the ultra-soft silicone sheet. It can be automatedly dispensed and coated. It is the best heat dissipation solution when multiple chips share a radiator and structures.
Thermal conductivity ≥12.0 W/m.K
Replace traditional assembled sheets with non-shaped forms
Glue dispensing can be carried out through various manual or automated processes
Soft, can eliminate assembly stress, and provide shock damping
| Project | Technical indicators | Testing instrument | Testing standards |
|---|---|---|---|
| Color | gray | Visual inspection | -- |
| Density（g/cc） | 3.4（±0.3） | ZMD-2 Electronic density meter | ASTM D 792 |
| Extrusion rate（g/min） | ≥15（@90psi） | Dispensing machine | φ2.41mm EFD Injection head |
| Minimum filling gap（mm） | ≤0.3 | Thermal conductivity tester | -- |
| Flame retardant level | V-0 | flame retardant testing machine | UL-94 |
| Operating temperature(℃) | -40~125 | XB-OTS-150D-C Programmable thermal shock test chamber | IEC 60068-2-14 |
| Thermal conductivity（W/m·k） | ≥12.0 | LW-9389 Thermal conductivity tester | ASTM D 5470 |
| Thermal resistance(℃in2/W) | ≤0.07(@60psi) | LW-9389 Thermal conductivity tester | ASTM D 5470 |
| Breakdown voltage（KV/mm） | ≥5 | Pressure testing instrument | ASTM D 149 |
| Volume resistivity（Ω·cm） | ≥1010 | high resistance meter | ASTM D 257 |
| Dielectric constant | ≥2 | @1MHz | ASTM D 150 |
| Medium loss | ≤0.1 | @1MHz | ASTM D 150 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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