HLM 03 is a new type of ultra-thin thermal pad with ultra-low thermal resistance and excellent flexibility. This thermal pad mainly uses liquid metal as the thermal conducting material, and advanced preparation technology is adopted to composite the liquid metal into a thermal conductive sheet to ensure that there is no risk of leakage. At the same time, it shows an excellent heat conduction paths, greatly improving heat conduction efficiency. This product, with an effective temperature range of 60~140℃, is particularly suitable for high-performance devices with high heat flux density such as CPU and GPU, and can be used as a substitute material for thermal silicone grease and indium sheet.
Low thermal resistance
No leakage
Good thermal stability
Good ductility
The corrosion on AI/CU is not significant
| Project | Technical indicators | Testing instrument | Testing standards |
|---|---|---|---|
| Color | Silver | Visual | - |
| Specifications(mm) | -- | Digital caliper | ASTM D 5947 |
| Thickness(mm) | 0.1-0.5 | Digital caliper | ASTM D 374 |
| Density(g/cc) | 7.2(±0.2) | ZMD-2 Electron Density Meter | ASTM D 792 |
| Melting point（℃） | 140(±10） | Constant temperature electric heating plate | GB/T 1425-2021 |
| Tensile strength（Mpa） | ≥3（@50psi） | Compression Tester | ASTM D 575 |
| Compression ratio（%） | ≥20（@50psi） | Compression Tester | ASTM D 575 |
| Vertical resistance（Ω） | ≥10-3 | Megohmmeter | ASTM D 257 |
| Surface resistance（Ω） | ≥10-3 | Megohmmeter | ASTM D 257 |
| Thermal resistance(℃·cm2/W) | ≤0.04(@50psi) | LW-9389 Thermal Conductivity Tester | ASTM D 5470 |
| Operating temperature (℃) | -40~160 | XB-OTS-150D-C Programmable Thermal Shock Chamber | IEC 60068-2-14 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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