HCF-03E is an ultra-thin new carbon fiber thermal pad with ultra-low thermal resistance. The thermal pad mainly uses carbon fiber as a highly thermally conductive filler,using advanced preparation techonlogy to make the carbon fiber vertically arranged in the polymer matrix to form a good thermal conduction path in the vertical direction, greatly enhance the heat transfer efficiency, particularly applicable to base station, chip, etc high heat flux equipment.In addition, the ultra-thin carbon fiber thermal pad has high flexibility and ultra-low thermal resistance, which can be used as thermal grease replaced material.
The surface is soft and compressible
Low thermal resistance
Applications at low pressures
Good thermal stability
| Project | Technical indicators | Testing Standards |
|---|---|---|
| Color | Gray-black | Visual |
| Specifications（mm） | 120*120 | ASTM D 5947 |
| Thickness（mm） | 0.3~3（±10%） | ASTM D 374 |
| Hardness（Shore 00） | 65（±10） | ASTM D 2240 |
| Density（g/cc） | 1.85（±0.5） | ASTM D 792 |
| Resilience（%） | ＞30 | ASTM D 575 |
| Oil seepage rate（%） | ＜3 | HFC |
| Operating temperature（℃） | -40~125 | IEC 60068-2-14 |
| Thermal resistance（°Cin²/W） | ≤0.04(@40psi/0.3mm) | ASTM D 5470 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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