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  • HFS-15 Thermal Gap Filler

HFS-15 Thermal Gap Filler

HFC HFS-18 is a high-efficiency thermally conductive gasket with good thermal conductivity and low thermal resistance, which can effectively fill the gap between the heating end and the cooling end, and achieve efficient heat transfer between the heating part and the cooling part Amplitude reduces interface thermal resistance. At the same time, the high-efficiency heat sink can also be used under lower stress conditions to avoid damage to chips, PCBs and other components from mounting stress. The product is extremely technical and usable, and can be used in devices such as photovoltaic modules and Netcom that require .


●High thermal conductivity and low thermal resistance

●Low stress assembly

●Good thermal stability

●Multiple thickness options, wide range of applications


PROPERTIES
ItemsParameterUnitTest Method
ColorBlack-Visual
Specification120*120mmASTM D 5947
Thickness0.5~3mmASTM D 374
Hardness55(±10)Shore 00ASTM D 2240
Density2.7(±0.2)g/ccASTM D 792
Tensile Strength≥0.1MpaASTM D 412
Elongation≥100%ASTM D 412
Tear strength≥0.5N/mmASTM D 624
Compression Ratio≥50(@50Psi)%ASTM D 695
Operating Temperature-50~130IEC 60068-2-14
THERMAL CHARACTERISTIC
Thermal conductivity24.0(±5)W/m·KASTM D 5470
Thermal resistance≤0.15(@20psi&2mm)℃in2/WASTM D 5470





  • Satellite
  • radar and other military fields
    Between chip and heat-dissipation modules
    Optoelectronic Industry
    Netcom products
    Wearable equipments
COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
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Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: oversea@szemi.cn
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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