HFC HTG-S800 Thermally conductive gel is a thermal interface material with single-component. The material has some stress-strain value superior than the ultra-soft silicone sheet. It can be automatedly dispensed and coated. It is the best heat dissipation solution when multiple chips share a radiator and structures.
8.0(±0.5)W/m.K thermal conductivity
Does not cure
Dispensing can be done by a variety of manual or automated processes
Soft, relieves assembly stress, shock absorption damping
| project | Technical indicators | Testing instruments | Testing standards |
|---|---|---|---|
| color | grey | Visual | -- |
| density（g/cc） | 3.6（±0.3） | ZMD-2Electron density meter | ASTM D 792 |
| Extrusion rate（g/min） | ≥30（@90psi） | Dispenser | φ2.41mm EFD Injection head |
| Fill gaps with minimal filling（mm） | ≤0.2 | Thermal conductivity tester | -- |
| Volatile content（PPM） | ≤200 | oven | GB269 |
| Instantaneous compressive stress（Psi） | ＜10 | Compressive stress tester | GB/T 7757 |
| Static compressive stress（Psi） | ＜1 | Compressive stress tester | GB/T 7757 |
| Flame retardant rating | V-0 | Flame retardant tester | UL-94 |
| Operating temperature(℃) | -40~150 | XB-OTS-150D-C Programmable Hot and Cold Shock Chamber | IEC 60068 |
| thermal conductivity（W/m·k） | 8.0（±0.5） | LW-9389Thermal conductivity tester | ASTM D 5470 |
| Thermal resistance(℃in2/W)(@20psi&1mm) | ≤0.06(@60psi) | LW-9389Thermal conductivity tester | ASTM D 5470 |
| Breakdown voltage（KV/mm） | ≥5 | Withstand voltage tester | ASTM D 149 |
| Volumetric resistivity（Ω·cm） | ≥108 | High resistance meter | ASTM D 257 |
| Storage conditions and package rules | Store refrigerated or in a dark place, storage temperature: ≤30°C, storage humidity: ≤70% | ||
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
Copyright © Shenzhen HFC Co., Ltd. All Rights Reserved | Sitemap | Technical Support 
