HCF-14 is a carbon fiber thermal pad with high thermal conductivity and low thermal resistance. The thermal pad uses advanced arrangement technology to make the carbon fibers evenly and vertically distributed in the silicone matrix, greatly improving the efficiency of heat transfer. This carbon fiber thermal pad maintains high thermal conductivity and high flexibility of silicone material. It can work normally under extremely low stress conditions. It is mainly used to solve the high heat flux devices' solutions such as large servers and chips.
The surface is soft and compressible
Low thermal resistance
Lightweight, high resilience
Applications at low pressures
Good thermal stability
Project | Technical indicators | Testing standards |
---|---|---|
Color | Gray-black | Visual |
Specifications(mm) | 120*120 | ASTM D 5947 |
Thickness(mm) | 0.5~3 | ASTM D 374 |
Hardness(Shore 00) | 55(±10) | ASTM D 2240 |
Density(g/cc) | 2.0(±0.2) | ASTM D 792 |
Operating temperature(℃) | -40~125 | IECM 60068-2-14 |
Thermal conductivity (W/m•K) | 25.0(±5) | ASTM D 5470 |
Thermal resistance(°Cin²/W ) | ≤0.18(@20psi/2mm) | ASTM D 5470 |
Production equipment and testing equipment to ensure high quality.
Power prodcution and processing plant,specializing in customizing products.
Intimate after-sales team,respond quickly to each customers queston.
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