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  • Carbon fiber thermal pad 25W

Carbon fiber thermal pad 25W

HCF-14 is a carbon fiber thermal pad with high thermal conductivity and low thermal resistance. The thermal pad uses advanced arrangement technology to make the carbon fibers evenly and vertically distributed in the silicone matrix, greatly improving the efficiency of heat transfer.  This carbon fiber thermal pad maintains high thermal conductivity and high flexibility of silicone material.  It can work normally under extremely low stress conditions.  It is mainly used to solve the high heat flux devices' solutions such as large servers and chips.

  • The surface is soft and compressible

  • Low thermal resistance

  • Lightweight, high resilience

  • Applications at low pressures

  • Good thermal stability


ProjectTechnical indicatorsTesting standards
ColorGray-blackVisual
Specifications(mm)120*120ASTM D 5947
Thickness(mm)0.5~3ASTM D 374
Hardness(Shore 00)55(±10)ASTM D 2240
Density(g/cc)2.0(±0.2)ASTM D 792

Operating temperature(℃)

-40~125 IECM 60068-2-14

Thermal conductivity (W/mK)

 25.0(±5)
  ASTM D 5470

Thermal resistance(°Cin²/W )

≤0.18(@20psi/2mm)  ASTM D 5470



COMPANY STRENGTH

Focus on innovative EMC and Thermal interface material R&D.

High capacity,short delivery cycles.

Product patent research and deveplopment results, adhere to innovation and make.

COMPANY STRENGTH
300

Production equipment and testing equipment to ensure high quality.

15000

Power prodcution and processing plant,specializing in customizing products.

Intimate after-sales team,respond quickly to each customers queston.

Tel

+86 755 2370 6023

Fax

+86 755 2730 6260

Add

Shenzhen, China 

 
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Contacts
  • Tel: +86 755 2334 2723
  • Mob.: +86 135 3065 9319
  • Fax: +86 755 2730 6260
  • E-mail: avril@hfctech.com
  • Add.: C Bldg 3rd Industrial Park,Fenghuang Fuyong Town,Bao’an District,Shenzhen, China 518000

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